Ce nouveau matériau promet de donner un gros coup d'accélérateur à l'IA

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News Home » Browse News » Ce nouveau matériau promet de donner un gros coup d'accélérateur à l'IA

Posted by - Senbookpro KAAYXOL -

on - 2 hours ago -

Filed in - Technology -

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Des chercheurs de l'Université de Houston ont mis au point un isolant en couches minces qui va permettre de fabriquer des puces d'IA beaucoup plus rapides et nettement plus économes en énergie.

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