Samsung has been chasing NVIDIA's approval for its HBM3E high-bandwidth memory modules for the better part of a year. There's insatiable demand for NVIDIA's AI accelerators and those chips require copious amounts of high-bandwidth memory, so an order from that company could potentially be worth billions.

NVIDIA has put Samsung's HBM3E chips through several tests but it's believed that concerns regarding thermal management have so far prevented the chips from clearing those tests. There's renewed hope now that an approval could come by June this year.

Samsung has reportedly redesigned some elements of the chip to address NVIDIA's concerns relating to heat generation, power consumption, and performance. The chips have been submitted for testing and while the results were previously expected to arrive in May, the latest reports out of South Korea suggest that they may now come in June.

The report adds that the minimum requirements following the audit of Samsung's Onyang campus have been met. Expectations are now high within the company that internal tests will be passed with flying colors. The final stage of semiconductor manufacturing is carried out at the Onyang campus, which includes packaging, production, testing, and shipping of the end product.

The lack of orders from NVIDIA have become a significant drag on Samsung's semiconductor revenues as it also deals with intense Chinese competition for legacy memory products. An approval from NVIDIA may enable Samsung to turn its fortunes around. SK Hynix and Micron are currently NVIDIA's top suppliers for HBM3E chips, with the former reporting record quarterly profits on the back of its increased HBM shipments.