Samsung’s latest flagship chipset for mobile devices, the Exynos 2600, brings a ton of upgrades. One of them is the Heat Path Block (HPB), which helps in dissipating the heat in a better way compared to current methods, reducing thermal throttling and improving performance. A recent report suggested that Apple and Qualcomm are planning to adopt this technology for their chipsets. 

Well, the latter’s next flagship chipsets for mobile devices, which are expected to be the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Gen 6 Pro, SoCs that Samsung may use for its non—foldable flagship smartphones for 2027, the Galaxy S27 series, may feature the HPB technology.

On Weibo, Fixed Focus Digital Cameras claims that Qualcomm may use Samsung’s Heat Path Block (HPB) technology for its next flagship chipsets for mobile devices, the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Gen 6 Pro (via WCCFTech).

At the moment, there’s no information if Qualcomm will get the two chipsets made by Samsung Foundry, on its second-generation 2nm process, in order equip them with HPB, if it will license the technology from the South Korean tech giant and get the SoCs made from TSMC, or will come up with its own technology similar to Heat Path Block and equip the upcoming chipsets with it.

Samsung is expected to continue using Qualcomm's flagship chipsets for its future flagship smartphones, at least for some regions. To that extent, the Galaxy S27 series phones may feature the Snapdragon 8 Elite Gen 6 or the Galaxy 8 Elite Gen 6 Pro. With these SoCs featuring the HPB technology, these phones may offer better sustained performance than their predecessors while running cooler.