Samsung is one of the world's largest semiconductor chipmakers. It continuously advances its chip fabrication capabilities each year. The company has now expanded its partnership with Dutch semiconductor equipment giant ASML to produce more advanced logic and memory chips for the AI era.

Under this collaboration, Samsung will use ASML's High-NA EUV (Extreme Ultraviolet) lithography equipment. Samsung is also joining an industry initiative to adopt next-generation 12-inch photomasks, moving away from the decades-old 6-inch standard.

This shift will boost fab (chip fabrication plant) productivity, lower chipmaking costs, and remove stitching constraints on the most advanced chip manufacturing nodes. Samsung will work closely with industry partners to develop the necessary mask technologies and infrastructure to support this transition.

Additionally, Samsung has also announced plans to use High-NA EUV machines for high-volume DRAM manufacturing by 2028. This will mark the industry's first use of High-NA EUV for DRAM production, extending the memory scaling roadmap and simplifying manufacturing steps and improving production efficiency.

Young Hyun Jun, Vice Chairman and CEO of Samsung Electronics, said that the AI era demands innovation across the entire chip value chain, adding that the expanded partnership with ASML establishes the foundation for Samsung's future leadership in AI hardware and semiconductor manufacturing.